Method for fluid and semifluid die stamping and apparatus...

B - Operations – Transporting – 22 – D

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22/172, 22/70

B22D 17/12 (2006.01) B21J 5/00 (2006.01) B22D 18/02 (2006.01)

Patent

CA 1066867

ABSTRACT OF THE DISCLOSURE: Method for fluid or semifluid die stamping, comprising the steps of: effecting an initial stamping of the fluid or semifluid material poured into a stamping die by the stroke of a male part of a stamping die, and when the male part of the stamping die reaches its extreme position and ceases its movement, making act on the material a compressed gas, which is enclosed at the beginning of the working cycle in at least one cavity of the stamping die between the material being stamped and the stamping die itself. The apparatus for carrying out this method comprises a stamping die having a female part and male part, said male part being provided with at least one cavity opened towards the surface of the material to be stamped, at the beginning of the working cycle a compressed gas being contained in the space between the male part and the material to be stamped.

234316

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