Maskless method for electroless plating patterns

B - Operations – Transporting – 05 – D

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117/77

B05D 3/06 (2006.01) B23K 26/34 (2006.01) C23C 18/16 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1120656

MASKLESS METHOD FOR ELECTROLESS PLATING PATTERNS Abstract A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 103 to 104. This enhancement is sufficient to make masking unnecessary. YO979-021

347870

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