Bonding method

Details Bonding method Bonding method

C - Chemistry, Metallurgy

09

J

154/107, 154/41

C09J 7/00 (2006.01) C09J 5/06 (2006.01)

Patent

CA 1128847

N-2-21237C/79 ABSTRACT OF THE DISCLOSURE A method for bonding which comprises: interposing between the articles to be bonded at least one of which has an aqueous moisture content in a normal condition of at least about 1% by weight based on the weight of the article, a moisture curable adhesive material and then heating the assembly under pressure to supply water vapor from the moisture containing article to cure the adhesive material, wherein said adhesive material comprises a sheet, film or tape of a thermo- fusible adhesive resin and/or rubber containing about 0.1 to 20% by weight based on the weight of the resin and/or rubber of a carboxyl group and not more than about 0.5% by weight free water and uniformly dispersed therein, a powder of an oxide of metal of Group IIa of Mendeleev's Periodic Table having an average particle diameter of about 0.1 to 1,000µ.

324475

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