Metallizing compositions

C - Chemistry – Metallurgy – 22 – C

Patent

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117/162, 75/27

C22C 1/10 (2006.01) C04B 41/51 (2006.01) C04B 41/88 (2006.01) H01B 1/16 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1069349

Abstract of the Disclosure Metallizing compositions suitable for the production of fired on electrically conductive films which do not adversely af- fect the overall strength of heat resistant substrates are des- cribed. The compositions comprise, in specified proportions, at least one finely divided electrically conductive metal, certain alkali metal, crystallizable, high silica glass frits as binder, inert liquid vehicle and, if desired, inert filler and/or pigment. The compositions are particularly suited to glass substrates and provide therewith composite structures having greater strength than that of the glass substrate.

265708

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