Tape-mounted electronic-component package

B - Operations – Transporting – 65 – D

Patent

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229/30, 219/8

B65D 5/35 (2006.01) B65D 73/02 (2006.01) B65D 85/672 (2006.01)

Patent

CA 1063568

ABSTRACT OF THE DISCLOSURE Electronic components having parallel leads are mounted equi- distantly on a support tape. The tape is wound in a spiral around a cylindri- cal core and packaged in a box prepared from a box blank. The box is formed of two distinct portions. One portion has a base, three sides and cover. The base has a centrally positioned core member which receives rotatably the cylindrical core when the spiral is dropped into the box. The other portion has a side and retaining flap. The second portion is inserted in the first portion such that the side closes the open side of the first portion and the retaining flap slides just under the cover. The other portion may be removed from the first portion to form an opening through which the tape and the electronic components mounted thereon can be fed either manually or automatically without opening the package itself. The retainer flap serves to hold the tape and the electronic components mounted thereon firmly in position within the box during transit or other movement of the box.

303658

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