Siloxane-epoxy molding compound with improved crack resistance

Details Siloxane-epoxy molding compound with improved crack resistance Siloxane-epoxy molding compound with improved crack resistance

C - Chemistry, Metallurgy

08

L

400/5342

C08L 83/04 (2006.01) C08G 59/68 (2006.01) C08L 63/02 (2006.01) C08L 63/04 (2006.01)

Patent

CA 1103832

ABSTRACT OF THE DISCLOSURE An improved curable siloxane-epoxy molding composition which is a blend of a phenylpolysiloxane, an aluminum catalyst, a silica filler, and an aromatic polyepoxide resin which contains at least 38 percent by weight of a polydiglycidyl ether of a bisphenol is disclosed. The molding composition has improved thermal shock crack resistance when used to encapsulate electronic devices.

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