Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

Category

C - Chemistry, Metallurgy

Subcategory

08

Subsubcategory

G

CPC

402/182, 402/216

IPC codes

C08G 73/12 (2006.01) C08F 222/40 (2006.01) C08F 290/02 (2006.01)

Type

Patent

Patent number

CA 1150444

Description

Abstract of the Disclosure: Disclosed is a thermosetting resin composition comprising (a) a bismaleimide and/or a polymaleimide and (b) at least one member selected from alkenylaniline derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated substance.

Application Number

355840

Affiliated with

Also associated with

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