Process for the production of solder masks for printed circuits

Details Process for the production of solder masks for printed circuits Process for the production of solder masks for printed circuits

H - Electricity

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H05K 3/34 (2006.01) B05C 5/00 (2006.01) B23K 35/22 (2006.01) G03F 7/16 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1118530

Case 37-11464/= Abstract of the Disclosure PROCESS FOR THE PRODUCTION OF SOLDER MASKS FOR PRINTED CIRCUITS A process for producing solder masks on double sided printed circuit boards, comprising conveying the boards beneath a free falling curtain of a photopolymer to form a thin layer on a surface of the board, irra- diating with ultra violet light areas of the surface other than those that need to be soldered and then, by subsequent development, dissolving the unirradiated areas of the layer. The viscosity of the photopolymer is between 500 to 1200 mPa's at impingement on the surface of the circuit and the height of the curtain is selected so that the rate of flow of the polymer onto the circuit is between 60 to 160 m/min. Also the rate at which the circuits are conveyed beneath the curtain is greater than a rate slightly less than the rate at which the polymer flows onto the circuit.

316616

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