Procedure for removing plating rests from a plated wire

Details Procedure for removing plating rests from a plated wire Procedure for removing plating rests from a plated wire

C - Chemistry, Metallurgy

25

D

204/15.5

C25D 7/06 (2006.01) B21C 43/00 (2006.01) C25D 5/48 (2006.01)

Patent

CA 1117892

ABSTRACT OF THE DISCLOSURE . The invention provides a method for removing residue such as acid crystals and liquid originating from a plating bath from the surface of the plated wire during the continuous, electrolytic plating of wire, wherein the surface of the wire is treated mechanically while a transporting liquid is applied to the wire, in which liquid the plating residue is carried away without being dissolved in or emulsified with the same.

302701

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