C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/24, 204/22.5
C25D 5/54 (2006.01) C25D 5/56 (2006.01) H05K 3/18 (2006.01)
Patent
CA 1037896
Abstract of the Disclosure A process for metalizing a non-conductive substrate wherein the substrate is coated with an organic polymer- carbon black mixture, having a volume resistivity of less than about 1000 ohm-centimeters, the surface of the mixture is caused to contain sulfur and the thus treated substrate is placed as a cathode in a nickel, cobalt or iron plating bath to cause a rapid spread of metal across the thus treated surface.
203843
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