C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
400/5407
C08F 299/02 (2006.01)
Patent
CA 1126428
ABSTRACT OF THE DISCLOSURE Low temperature curing aqueous coatings are provided in which the resin solids are constituted by an epoxy ester of a resinous polyepoxide with at least about 0.2 moles of monocarboxylic acid containing conjugated unsa- turation and at least about 0.5 mole of monocarboxylic acid containing nonterminal epoxy nonconjugated unsaturation per equivalent in the polyepoxide. This epoxy ester is substantially free of epoxy groups and is copolymerized in solvent solution with monoethylenic monomers containing terminal unsaturation, including about 3% to about 20% carboxyl-functional monomers based on the weight of the copolymer to provide a nongelled, solvent-soluble copolymer possessing residual ethylenic unsaturation so that the copolymer can be dis- persed in water with the aid of a base. These epoxy ester copolymers will dry and cure in air at room temperature. Also, and by including in the copolymer a proportion of monoethylenic monomer containing terminal unsatura- tion and providing a primary hydroxy group, the copolymer contains primary hydroxyl groups as well as carboxyl groups and residual unsaturation so that when aminoplast or phenoplast resin is incorporated in the water solutions, the applied coatings cure at remarkable low temperature to form solvent and corrosion-resistant coatings.
291817
Sekmakas Kazys
Shah Raj
Desoto Inc.
Fetherstonhaugh & Co.
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