Method of and apparatus for selectively surface-treating...

C - Chemistry – Metallurgy – 25 – D

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204/12, 204/122

C25D 5/02 (2006.01)

Patent

CA 1156881

Abstract of the Disclosure The treatment of a selected area of a body by a solution is obtained by ejecting the solution towards the body and ejecting gas to control the flow of solution to restrict contact between solution and body to the se ted area. The invention is particularly concerned with the plating of part of one surface of a rectangular cross-sectioned pin, for example a terminal pin. A particular example is the gold plating of one end of one surface of a rectangular terminal pin, while preventing plating of the other surfaces. Pins, in bandoliers, are carried through a tank, with nozzles on each side. Solution is ejected at one side and a gas at the other side. The gas flows round the pins and restricts wetting to one surface of the pin.

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