Integrated circuit package utilizing novel heat sink structure

Details Integrated circuit package utilizing novel heat sink structure Integrated circuit package utilizing novel heat sink structure

H - Electricity

05

K

356/110

H05K 7/20 (2006.01) H01L 21/56 (2006.01) H01L 23/433 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1040747

Application for Patent of Robin H. Hodge for INTEGRATED CIRCUIT PACKAGE UTILIZING NOVEL HEAT SINK STRUCTURE ABSTRACT OF THE DISCLOSURE An integrated circuit package for power applications includ- ing a novel heat sink structure affixed to the die mounting pad, the heat sink being exposed through the bottom surface of the plastic encapsulated package so as to be free of any plastic film covering, the heat sink being provided with two pairs of integral flexible fingers extending upwardly from the ends of the heat sink so as to engage the upper wall of the cavity mold in which the package is encapsulated and to hold the heat sink in place against the lower wall of the cavity mold.

243375

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