Enclosure for encapsulating electronic components

Details Enclosure for encapsulating electronic components Enclosure for encapsulating electronic components

H - Electricity

05

K

356/168

H05K 5/00 (2006.01) H01L 23/047 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01)

Patent

CA 952234

Affiliated with

Also associated with

Rating

Enclosure for encapsulating electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enclosure for encapsulating electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enclosure for encapsulating electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-61639