Storage, rapidly hardening epoxy resin adhesive

Details Storage, rapidly hardening epoxy resin adhesive Storage, rapidly hardening epoxy resin adhesive

C - Chemistry, Metallurgy

08

L

400/3038

C08L 63/00 (2006.01) C08G 59/50 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1109986

Abstract of the Disclosure A storable, rapidly hardening epoxy resin adhesive consisting essentially of a) a polyglycidyl compound having a softening temperature between 40° and 90°C, b) a salt of 1 mole of ethylenedimine, 1 mole of bisphenol A d 2 g of N,N-dimethyl-1,3-diaminopropane, c) an ABS graft polymer and d) a copolymer of ethylene, acrylic acid and acrylate having a melting range from 70° to 110°C, said adhesive comprises, er 1 equivalent of glycidyl groups, 0.5 to 1.5 equivalents of hydrogen atoms bonded to nitrogen of ethylenediamin and of N,N-dimethyl-1,3-diaminopropane, and per 100 parts of the polyglycidyl compound contains 3 to 30 parts by weight of the ABS graft polymer and 3 to 20 parts by weight of the copolymer of ethylene, acrylic acid and acrylate, and said adhesive is in the form of a fine heterogeneous powder.

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