Non-curing silicone pressure sensitive adhesives

Details Non-curing silicone pressure sensitive adhesives Non-curing silicone pressure sensitive adhesives

C - Chemistry, Metallurgy

08

L

400/3009

C08L 83/04 (2006.01) C08L 83/10 (2006.01) C09J 183/04 (2006.01) C09J 183/10 (2006.01)

Patent

CA 1088695

ABSTRACT OF THE DISCLOSURE Pressure sensitive adhesives which require no cure to develop maximum adhesive properties are obtained from mixtures of (1) from 30 to 70 weight percent of block copolymers of (A) styrenic monomers and (B) polydi- methylsiloxane in which the styrenic blocks account for from 5 to 25 percent by weight of the total weight of the block copolymer and (2) from 30 to 70 percent by weight based on the total weight of (1) and (2) of a copolymer of Me3SiO.5 and SiO2 units in which the mol ratio of Me3SiO.5 to SiO2 is from 0.6:1 to 0.9:1 and Me is a methyl radical. A typical example of (1) is a block copolymer of styrene and dimethylpolysiloxane.

300081

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