Apparatus and method for transferring semiconductor wafers

Details Apparatus and method for transferring semiconductor wafers Apparatus and method for transferring semiconductor wafers

H - Electricity

01

L

356/195

H01L 21/68 (2006.01) H01L 21/673 (2006.01)

Patent

CA 1049662

APPARATUS AND METHOD FOR TRANSFERRING SEMICONDUCTOR WAFERS Abstract of the Disclosure A modified etch boat acts as a transfer device for transferring wafers, in bulk. An etch boat has a longitudinal hole through one wall near the top edge, the hole periphery extending into Vee grooves in the etch boat. With wafers in the grooves, a rod inserted through the hole prevents wafers from falling out. With wafers in a storage box, the modified etch boat is positioned on the storage box, the whole inverted, and then the rod inserted after the wafers have transferred. The etch boat can then be inverted over a furnace boat, for example. After positioning on the furnace boat, with the wafers lifted slightly, the rod is removed and then the etch boat lifted off. The reverse operation is used to transfer from a furnace boat. j

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