Method for applying adhesive resin on a circuit board

Details Method for applying adhesive resin on a circuit board Method for applying adhesive resin on a circuit board

H - Electricity

05

K

356/192

H05K 3/00 (2006.01) B41F 15/46 (2006.01) H05K 3/12 (2006.01)

Patent

CA 1137650

S01295 S80P45 METHOD FOR APPLYING ADHESIVE RESIN ON A CIRCUIT BOARD ABSTRACT OF THE DISCLOSURE A printing screen having a pattern of previous print- ing areas and impervious non-printing areas is angularly dis- placed to an operative position parallel to, but slightly spaced from a substrate on which a resin pattern is to be printed. A resilient blade or squeegee is wiped across the screen in its operative position for both pressing the screen down against the substrate and squeezing semi-liquid resin through the pervious areas into contact with the substrate. Upon completion of such wiping operation, the resilient blade is lifted from the screen and the screen is maintanied in its operative position parallel to the substrate for a sufficient time to permit the substantially vertical collapse of resin threads bridging the space between the printed pattern and the screen. -i-

350330

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