Cationically curable organic resin compositions containing...

Details Cationically curable organic resin compositions containing... Cationically curable organic resin compositions containing...

C - Chemistry, Metallurgy

08

K

402/250, 402/391

C08K 5/00 (2006.01) C08L 57/00 (2006.01) C08L 87/00 (2006.01)

Patent

CA 1118936

ABSTRACT OF THE DISCLOSURE Heat curable organic resin compositions, such as epoxy resins, are provided, based on the use of dialkylhydroxy- arylsulfonium salts in combintion with certain organic oxidants such as iodosoaromatic esters, or the use of certain amines or transition metals in combination with organic peroxides. The heat curable compositions can provide flexible or rigid organic resin foam when used with a volatiie organic solvent as a result of exothermic heat of cure.

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