High density air cooled wafer package having improved...

Details High density air cooled wafer package having improved... High density air cooled wafer package having improved...

H - Electricity

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H01L 23/02 (2006.01) H01L 23/367 (2006.01) H01L 23/373 (2006.01) H01L 23/42 (2006.01) H01L 23/538 (2006.01) H01L 25/065 (2006.01)

Patent

CA 1043469

HIGH DENSITY AIR COOLED WAFER PACKAGE HAVING IMPROVED THERMAL DISSIPATION Abstract A high density low profile air cooled wafer package including flip chip and embedded logic or memory islands upon a wafer package mounted within a heat dissipating cover having improved thermal dissipation. Heat dissipa- tion is achieved through a thermal grease interface provided between the wafer carrier and the heatsink cover, with pressure being applied to the interface by partially deflected electrical connectors secured there between.

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