Resin compositions based on polyphenylene ether

C - Chemistry – Metallurgy – 08 – L

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C08L 53/02 (2006.01) C08G 65/44 (2006.01) C08L 9/06 (2006.01) C08L 25/04 (2006.01) C08L 71/12 (2006.01)

Patent

CA 1138146

ABSTRACT OF THE DISCLOSURE A resin composition based on a polyphenylene ether comprising 99 to l part by weight of a polyphenylene ether copolymer derived from 99.5 to 85 mole-% of 2,6- dimethylphenol and 0.5 to 15 mole-% of 3-methyl-6- tert-butylphenol and 1 to 99 parts by weight of a styrene polymer (making up 100 parts by weight in total); and said resin composition further containing 0.1 to 100 parts by weight of a rubber-like polymer for 100 parts by weight of the said resin composition. These resin compositions are excellent in mechanical strengths, heat resistance, and moldability and are suitable as molding resin materials in practical use fields.

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