Method for encapsulating electrical components and the mould...

Details Method for encapsulating electrical components and the mould... Method for encapsulating electrical components and the mould...

H - Electricity

05

K

18/62

H05K 13/00 (2006.01)

Patent

CA 1043974

ABSTRACT OF THE DISCLOSURE Apparatus for encapsulating electrical components such as capacitors comprises a number of plastic moulds each having an open end in communication with a common trough-shaped pouring ingate. A liquid, hardenable plastics filling compound is poured into the moulds, via the ingate, in excess under vacuum and the plastics compound is then cured. After curing, the pouring ingate together with the remaining surplus filling compound is cut off from the encapsulated components and each mould remains as a case around the component contained inside.

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