C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
356/1, 117/198,
C09J 7/00 (2006.01) B32B 15/08 (2006.01) C08L 63/00 (2006.01) C09J 163/00 (2006.01) H01B 3/00 (2006.01) H01B 3/30 (2006.01) H05K 1/00 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1052493
Abstract An adhesive composition is disclosed that comprises a mixture of a) an epoxy-terminated polymer formed by reacting an epoxy compound with a carboxyl-terminated polymer, b) a polyhydroxy ether formed from bisphenol A and epichlorohydrin, and c) an epoxy-reactive curing agent. The adhesive is es- pecially useful to adhere an electrically conductive metal to an electrically insulating base sheet to form a multilayered sheeting useful as a component of electric circuitry.
220885
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