Producing printed circuits by soldering metal powder images

Details Producing printed circuits by soldering metal powder images Producing printed circuits by soldering metal powder images

H - Electricity

05

K

356/12

H05K 3/10 (2006.01) H05K 3/34 (2006.01) H05K 3/00 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1134053

ABSTRACT OF THE DISCLOSURE By the process of this invention, printed circuits are prepared containing an electrically conductive wiring trace from materials having adherent and non-adherent surface areas, e.g., printed circuit substrates bearing an imaged photoadhesive layer. Onto the adherent surface areas of the material is applied solder wettable metal particles, and any excess particles are removed from the non-adherent areas. The metallized areas are soldered to form an electrically conductive wiring trace.

320647

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