C - Chemistry – Metallurgy – 07 – F
Patent
C - Chemistry, Metallurgy
07
F
260/458.6
C07F 9/40 (2006.01)
Patent
CA 1052807
Abstract of the Disclosure Di-polyoxyalkylene hydroxymethylphosphonate is prepared by contacting phosphorous acid and formaldehyde, or a formal- dehyde polymer such as trioxane or paraformaldehyde, preferably in an aqueous medium, to yield a hydroxymethylphosphonic acid intermediate. The intermediate is then contacted with an alkylene oxide selected from ethylene oxide, propylene oxide or butylene oxide to yield di-polyoxyalkylene hydroxymethylphosphonate having the structural formula: Image wherein R is -CH2-, Image of Image and n + m = 2-10. Di-polyoxyalkylene hydroxymethylphosphonate is utilized as a flame retardant, a stabilizer for polyester film and as a plasticizer for cellulose acetate and polyvinyl acetate, among others.
230859
Shim Kyung S.
Walsh Edward N.
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