Method of mounting interrelated components

Details Method of mounting interrelated components Method of mounting interrelated components

H - Electricity

05

K

356/8

H05K 3/34 (2006.01) H01L 25/10 (2006.01) H05K 1/18 (2006.01)

Patent

CA 1159576

Abstract One specially designed fixture allows two components such as a microprocessor and its associated ROM to be simultaneously mounted on opposite surfaces of the substrate, with all or nearly all internal connections made through the area of the substrate between the components. A second fixture allows for wave soldering lead frames to the assembly while protecting the reflow soldered components. The method thus provides the most direct connections between the two components with all internal connections and external connections made by two automatic operations. a third component can be posi- tioned astraddle the mounted assembly for minimum lead lengths.

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