Composition board with improved polymeric skin and method of...

B - Operations – Transporting – 32 – B

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154/93

B32B 21/06 (2006.01)

Patent

CA 1116068

ABSTRACT OF THE DISCLOSURE A process for preparing a flexible, cured sheet mate- rial, the sheet material so prepared, and in particular composi- tion boards with the sheet material as a surface covering, which process comprises providing a first thin fibrous sheet mate- rial impregnated with a curable thermosetting resin; placing on- to one surface of the first sheet material a second flexible fi- brous sheet material which is capable of absorbing an adhesive material, and subjecting the first and second sheet materials to a high pressure of over about 20 kilos per centimeter square at a thermosetting resin-curing temperature, and for a period of time to bond the surface of the second sheet material to the con- tacting surface of the first sheet material by the cured resin. The thin sheet material is characterized by a hard, resin-cured surface and capable of absorbing an adhesive material. The sheet is bonded by contact pressure to a composition board surface with an adhesive layer thereon, which adhesive layer is absorbed into the sheet material.

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