Method and apparatus for soldering

Details Method and apparatus for soldering Method and apparatus for soldering

B - Operations, Transporting

23

K

113/80

B23K 1/00 (2006.01) B23K 3/00 (2006.01)

Patent

CA 1166086

ABSTRACT OF THE DISCLOSURE Soldering or brazing is facilitated by means of an apparatus which includes a soldering head defined by a solder feeding tube, a helical cooling duct surrounding the feeding tube, and a movable heat shield for shielding the solder feed- ing tube from the heat emanating from the torch; flexible ducts for feeding ribbon or rod solder to the head and for feeding and discharging coolant; thermocouples for determining the temperatures at the discharge end of the solder feeding tube and of the component being soldered; and a control for moving the shield and/or altering the rate of feed of coolant and/or solder depending on whether the temperatures are suitable for optimum welding or brazing.

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