Epoxy resin powder including ethylene-vinyl acetate copolymer

C - Chemistry – Metallurgy – 08 – G

Patent

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400/5111

C08G 59/40 (2006.01) C09D 163/02 (2006.01)

Patent

CA 1082835

ABSTRACT Stable, free-flowing epoxy resin powder which fuses to and cures upon striking an object which has been preheated to the curing temperature of the composition of the powder to provide a tough protective coating. The composition differs from the prior art in that it includes 3-30 parts of a copolymer of 2-50% vinyl acetate and 5-75% ethylene per 100 parts of the epoxy resin. The copolymer improves the flexibility of the cured coatings.

257525

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