Electroless metal plating

Details Electroless metal plating Electroless metal plating

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/16 (2006.01)

Patent

CA 1081406

ABSTRACT OF THE DISCLOSURE The present invention provides a method for operating an electroless metal plating solution that has evaporative losses of at least 1% of its volume per plating cycle to maintain the concentration of by-products formed by the plating reaction within an acceptable level, said method comprising the steps of maintaining the volume of the plating solution substantially constant, withdrawing a portion of the total plating solution during each plating cycle and replenishing the plating solution.

276510

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