Cured epoxy polymer having improved adhesive properties

Details Cured epoxy polymer having improved adhesive properties Cured epoxy polymer having improved adhesive properties

C - Chemistry, Metallurgy

08

L

400/4704, 117/75

C08L 63/02 (2006.01) B32B 15/08 (2006.01) C08G 59/18 (2006.01) C08G 59/30 (2006.01) C08L 63/10 (2006.01) C09J 163/00 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1060136

Abstract of the Disclosure A cured epoxy polymer having improved adhesive properties is disclosed. The epoxy polymer is the reaction product of a mixture comprising a resin component comprising (a) a diglycidyl ether based upon linoleic dimer acid, (b) an elastomerically modified epoxy resin blend and (c) a diglycidyl ether of bisphenol A and/or bisphenol F and a suitable curing agent. The reaction mixture is heated at a suitable temperature for a period of time sufficient to attain a full cure of the epoxy. The resulting cured epoxy shows good adhesion to electro- less metal deposited thereon without the need for pretreatment such as etching, solvation, abrasion etc. This is extremely useful in the production of metal-plated polymer parts.

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