Electronic circuit device and method of making the same

Details Electronic circuit device and method of making the same Electronic circuit device and method of making the same

H - Electricity

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356/12

H05K 1/00 (2006.01) G02F 1/13 (2006.01) H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 23/14 (2006.01) H01L 23/482 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01)

Patent

CA 1108305

ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME ABSTRACT Principal faces of semiconductor devices are bonded by means of a bond layer on one face (lower face) of a heat-resistive flexible synthetic resin film, for example, polyimide film, the other face (upper face) of the heat-resistive flexible synthetic resin film has bonded wiring conductor films of a specified wir- ing pattern, and specified parts of electrode metal layers or specified regions on the principal face of the semiconductor devices and specified parts of the wiring conductor films on the resin film are connected by conductor films formed extending between them through through-holes with sloped walls formed on the resin film. Also, a thin reinforcing frame of a metal film, formed on said one (lower) face of the resin film with a specified pattern, may be connected to the wiring conductor films through other through-holes with sloped walls.

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