Thermosetting phenolic resin coating and adhesive compositions

Details Thermosetting phenolic resin coating and adhesive compositions Thermosetting phenolic resin coating and adhesive compositions

C - Chemistry, Metallurgy

08

L

400/4110, 402/50

C08L 61/12 (2006.01) C08G 8/08 (2006.01) C09D 161/06 (2006.01) C09J 161/06 (2006.01) C08L 57/00 (2006.01) C08L 101/00 (2006.01)

Patent

CA 1121939

ABSTRACT OF THE DISCLOSURE A coating and adhesive composition that may be in finely divided powder form is provided comprising a solid phenolic resole (one-step) resin having a gel time of between 150 seconds to about 250 seconds at 150°C., said resin being the reaction product of bisphenol-A and for- maldehyde at a mole ratio between about 2.11 to 2.64 moles of formaldehyde per mole of bisphenol-A in the presence of a catalytic quantity of a condensation catalyst at a temperature of at least about 70°C. that is acidified to a pH from about 3 up to 7 and dehydrated.

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