Method of encapsulation

H - Electricity – 05 – K

Patent

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Details

347/1, 18/979

H05K 5/06 (2006.01) B29C 61/06 (2006.01) H02G 15/00 (2006.01) H02G 15/076 (2006.01) H02G 15/10 (2006.01) H02G 15/18 (2006.01)

Patent

CA 1112346

ABSTRACT A method of encapsulating a substrate, e.g., a cable splice, in a closure member containing a waterproof sealing material. The member also contains a heater by which the viscosity of the sealing material is reduced to cause it to flow into sealing contact with the substrate.

303524

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