H - Electricity – 05 – K
Patent
H - Electricity
05
K
347/1, 18/979
H05K 5/06 (2006.01) B29C 61/06 (2006.01) H02G 15/00 (2006.01) H02G 15/076 (2006.01) H02G 15/10 (2006.01) H02G 15/18 (2006.01)
Patent
CA 1112346
ABSTRACT A method of encapsulating a substrate, e.g., a cable splice, in a closure member containing a waterproof sealing material. The member also contains a heater by which the viscosity of the sealing material is reduced to cause it to flow into sealing contact with the substrate.
303524
Diaz Stephen H.
Horsma David A.
Fetherstonhaugh & Co.
Raychem Corporation
LandOfFree
Method of encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of encapsulation will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-992212