Process for bonding low-energy plastic surfaces

Details Process for bonding low-energy plastic surfaces Process for bonding low-energy plastic surfaces

C - Chemistry, Metallurgy

09

J

154/104

C09J 5/06 (2006.01) C08J 5/12 (2006.01)

Patent

CA 1124165

PROCESS FOR BONDING LOW-ENERGY PLASTIC SURFACES (Case D) Abstract of the Disclosure A process for bonding low-energy plastic surfaces having a critical surface tension of about 24 to about 37 dynes per centimeter to each other which comprises: (A) heating said surfaces that will be bonded to each other to a temperature of at least 50°C, (B) applying an adhesive composition effective in bonding low-energy plastic surfaces to each other to at least one of said surfaces, said adhesive composition comprising (1) an ethylene-vinyl ester copolymer having from about 4 to about 50 weight percent of a vinyl ester; (2) a tackifier and (3) a wax, and wherein said adhesive composition is in a temperature range of about 90 to about 250°C at the time of application and then (C) bringing said surfaces in contact with each other. -1-

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