3-d interconnected multi-layer microstructure of...

B - Operations – Transporting – 29 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B29B 7/00 (2006.01) B28B 1/00 (2006.01) B29C 45/00 (2006.01)

Patent

CA 2599238

Methods for compression molding through holes in polymer layers are provided, as are the resulting patterned polymer layers. Two key aspects of the invention are provision of a mold and substrate having different mechanical hardness , and provision of room for local flow of material. These aspects of the invention facilitate formation of through holes by compression molding that are not blocked or partially blocked by undesirable material. These polymer layers can be formed into three dimensional patterned structures by bonding patterned layers together. Since the layers include through holes, a three-dimensional polymer pattern can be formed. These patterned polymer layers and three dimensionally patterned polymer constructs have a wide variety of applications. For example, these constructs can be used for fabrication of micro-f luidic devices, and/or can be used for various medical and biological applications including drug delivery devices and tissue engineering devices.

L'invention concerne des procédés de moulage par compression de trous traversants dans des couches polymères ainsi que les couches polymères configurées obtenues. Deux aspects clés de l'invention sont la fourniture d'un moule et d'un substrat ayant une dureté mécanique différente et la fourniture d'espace pour l'écoulement local de matière. Ces aspects de l'invention facilitent la formation de trous traversant par moulage par compression qui ne sont pas bloqués ou bloqués partiellement par une matière indésirable. Ces couches polymères peuvent être transformées en structures configurées tridimensionnelles par assemblage de couches configurées. Etant donné que les couches comprennent des trous traversants, une configuration polymère tridimensionnelle peut être formée. Ces couches polymères configurées et les constructions polymères configurées en trois dimensions présentent une large variété d'applications. Par exemple, ces constructions peuvent être utilisées dans la fabrication de dispositifs microfluidiques et/ou peuvent être utilisées dans diverses applications médicales et biologiques, notamment dans des dispositifs d'administration de médicaments et des dispositifs de génie tissulaire.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

3-d interconnected multi-layer microstructure of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with 3-d interconnected multi-layer microstructure of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and 3-d interconnected multi-layer microstructure of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1659827

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.