3-step etching for contact window

H - Electricity – 01 – L

Patent

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Details

H01L 21/60 (2006.01) H01L 21/768 (2006.01) H01L 21/311 (2006.01)

Patent

CA 2238128

A 3-step etching method for contact windows in integrated circuit devices is disclosed, the first step being an anisotropic etching, the second step being an isotropic etching and the third step being an anisotropic etching, where the ratio of the etching depth formed by the third step to the total etching depth formed by said three steps is less than 0.5. The resultant contact window has a better aluminum step coverage, making more reliable electrical connections and without increasing much cost.

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