A bonding process

Details A bonding process A bonding process

C - Chemistry, Metallurgy

09

J

C09J 11/00 (2006.01) C08G 18/08 (2006.01) C08G 18/66 (2006.01) C09J 5/00 (2006.01) C09J 167/00 (2006.01) C09J 167/02 (2006.01) C09J 175/04 (2006.01)

Patent

CA 2222553

The proposed process for bonding together two substrates with an anhydrous or low-water-content partially crystalline adhesive which is solid at room temperature is characterised in that the adhesive is first activated by internal and/or external friction. The substrates are then joined together with the adhesive between them. When allowed to stand, the structure attains its final strength after a period of between a few seconds to a few days. The friction destroys the crystalline structure and causes the adhesive to become gluey, and re-crystallisation gives it its final strength and eliminates the gluey quality. The adhesive is based preferably on polyester or polyurethane and used preferably in the form of a gum stick without impermeable packaging. It is especially suitable for bonding paper, since it does not cause corrugation.

L'invention concerne un procédé de collage de substrat avec une colle solide à température ambiante, partiellement cristalline et exempte d'eau ou à faible teneur en eau. Ledit procédé est caractérisé en ce que l'on active tout d'abord la colle par friction interne et/ou externe. Les substrats sont ensuite assemblés au moyen de la colle appliquée entre eux. Après une phase de repos, la structure atteint sa solidité finale au bout d'une période allant de quelques secondes à quelques jours. La friction détruit la structure cristalline et donne à la colle son caractère adhésif. La colle atteint sa solidité finale puis perd son caractère adhésif par recristallisation. La colle est de préférence à base de polyester ou de polyuréthanne et est utilisée de préférence sous forme de bâton de colle sans emballage étanche. Elle se prête en particulier au collage de papier, car elle ne provoque pas d'ondulation.

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