A capsule for semiconductor components

Details A capsule for semiconductor components A capsule for semiconductor components

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/36 (2006.01) H01L 23/367 (2006.01) H01L 23/66 (2006.01)

Patent

CA 2336936

The present invention relates to a capsule (1) for at least one high power transistor chip (17) for high frequencies, comprising an electrically and thermally conductive flange (10), at least two electrically insulating substrates (15), and at least two electrical connections (16), and a cover member, where the high power transistor chip (17) is arranged on the flange (10). The high power transistor chip (17) and the electrically insulating substrates (15) are arranged on the flange (10). The electrical connections (16) are arranged on electrically insulating substrates (15) and the electrically insulating substrates (15) are connected to the flange (10) and open and separate from the high power transistor chip (17).

L'invention concerne une capsule (1) destinée à au moins une puce de transistor de grande puissance (17) destinée à des fréquences élevées. Cette capsule comprend un volet (10) électriquement et thermiquement conducteur, au moins deux substrats (15) d'isolation électrique, au moins deux connexions électriques (16) et un élément enveloppe. La puce de transistor de grande puissance (17) est placée sur le volet (10). La puce de transistor de grande puissance (17) et le substrat d'isolation électrique (15) sont placés sur le volet (10). Les connexions électriques (16) sont placées sur des substrats d'isolation électrique (15). Enfin, les substrats d'isolation électrique (15) sont connectés au volet (10), sont ouverts et séparés de la puce de transistor de grande puissance (17).

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