A chip module and process for the production thereof

Details A chip module and process for the production thereof A chip module and process for the production thereof

H - Electricity

01

L

H01L 23/498 (2006.01) H01L 21/58 (2006.01) H01L 21/60 (2006.01)

Patent

CA 2274785

A chip module (37) comprising a substrate (12) and at least one chip (38) arranged on the substrate, wherein the chip (11) is contacted via its terminal surfaces onto connecting leads (14, 15) of the substrate (12) and has a thickness d which is reduced compared to its original thickness D as a result of a removal of material on its rear side (39).

La présente invention porte sur un module de puce (37) avec un substrat (12) sur lequel est montée au moins une puce (38), laquelle (11) est mise en contact par ses surfaces de raccordement avec les câbles de raccord (14, 15) prévus sur le substrat (12) et présente, suite à un enlèvement électrochimique de matière au dos (39), une épaisseur d réduite par rapport à son épaisseur initiale D.

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