C - Chemistry – Metallurgy – 23 – G
Patent
C - Chemistry, Metallurgy
23
G
C23G 5/024 (2006.01) C11D 3/43 (2006.01) C11D 7/24 (2006.01) C11D 7/28 (2006.01) C11D 7/50 (2006.01) C11D 11/00 (2006.01) C23G 5/02 (2006.01) C23G 5/028 (2006.01) C23G 5/032 (2006.01) H05K 3/26 (2006.01) C11D 3/18 (2006.01) C11D 3/20 (2006.01) C11D 3/24 (2006.01) C11D 7/26 (2006.01) C11D 7/32 (2006.01)
Patent
CA 2111337
The present invention relates to a composition and a process of removing rosin solder flux and adherent soil from a printed circuit board. The composition comprises solvating agent and rinsing agent. Wherein the solvating agent is selected from the group consisting of terpenes, terpene-based compounds and rinsing agent is selected from the group consisting of chlorinated hydrocarbons, chlorofluorocarbons, fluorocarbons, hydrofluorocarbons, hydrochlorofluorocarbons, alcohols, fluorinated alcohols and mixture of these. The process for removing rosin solder flux from a circuit board comprises contacting the printed circuit board with a boiling liquid comprises solvating agent and rinsing agent.
Composition et procédé d'élimination du flux à souder à la résine et des souillures collées sur une carte à circuit imprimé. La composition comporte un agent de solvatation et un agent de rinçage. L'agent de solvatation est sélectionné dans le groupe constitué des terpènes et des composés terpéniques, et l'agent de rinçage est sélectionné dans le groupe constitué des hydrocarbures chlorés, des chlorofluorocarbones, des fluorocarbones, des hydrofluorocarbones, des hydrochlorofluorocarbones, des alcools, des alcools fluorés, et de leurs mélanges. Le procédé d'élimination du flux à souder à la résine d'une carte à circuit imprimé consiste à mettre celle-ci en contact avec un liquide en ébullition comportant l'agent de solvatation et l'agent de rinçage.
Hayes Michael E.
Hosman Donald P.
Hrebenar Kevin R.
Sell Robert D.
Petroferm Inc.
Smart & Biggar
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