A construction method of hybrid integrated circuit with...

Details A construction method of hybrid integrated circuit with... A construction method of hybrid integrated circuit with...

H - Electricity

01

L

H01L 25/11 (2006.01) H01L 29/78 (2006.01) H01L 31/0203 (2006.01)

Patent

CA 2251251

The invention relates to a construction method, by using a transparently protecting cap of transparent pentagon shaped high molecular polymer material and using a CHIP ON BOARD technique to replace a ceramic substrate. Thereby, eliminating a construction process required to glue a ceramic frame, a transparent glass and the ceramic substrate together. Thus, the invention has advantages of reducing fabrication levels, decreasing nitrogen gas leakage as well as material costs, and saving labors.

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