A contact pad and method of forming a contact pad for an...

Details A contact pad and method of forming a contact pad for an... A contact pad and method of forming a contact pad for an...

H - Electricity

01

L

H01L 23/485 (2006.01)

Patent

CA 2687424

A contact pad in an integrated circuit is disclosed. The contact pad comprises a flat portion comprising a base (302) of the contact pad; a plurality of projections (304, 306, 308, 310, 312) extending from and substantially perpendicular to the flat portion; and a solder ball (108, 124) attached to the projections and the flat portion. A method of forming a contact pad is also disclosed.

La présente invention concerne une plage de contact de circuit intégré qui comprend une partie plate comprenant une base (302) de plage de contact, une pluralité de projections (304, 306, 308, 310, 312) saillant de cette partie et sensiblement perpendiculaires à elle, et un globule de soudure (108, 124) fixée aux projections et à la partie plate. Un procédé de formation de plage de contact est également décrit.

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