A cooling powdering method with low temperature gas flow...

B - Operations – Transporting – 02 – C

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B02C 23/34 (2006.01) B02C 19/18 (2006.01) F25B 9/06 (2006.01)

Patent

CA 2192761

A cooling powdering method with low temperature gas flow circulation including a gas expansion cooling circulation system, a low temperature gas flow powdering system and a material refrigerating system. The gas expansion cooling circulation system serves to provide cold capacity for the low temperature gas flow powdering system and material refrigerating system and the gas flow powdering machine serves to powder the material. The method is able to powder those materials which are impossible or difficult to be powdered at normal temperature, especially for resilient polymer materials and high resilient bodies.

Méthode de pulvérisation par refroidissement avec une circulation d'écoulement gazeux à basse température comprenant un système de circulation de refroidissement à détente des gaz, un système de pulvérisation par écoulement gazeux à basse température et un système frigorifique de matériau. Le système de circulation de refroidissement à détente des gaz sert à fournir la capacité de froid pour le système de pulvérisation à écoulement gazeux à basse température et le système frigorifique de matériau, et la machine de pulvérisation à écoulement gazeux sert à pulvériser le matériau. La méthode permet de pulvériser les matériaux impossibles ou difficiles à pulvériser à une température normale, surtout les matériaux de polymère élastiques et les corps à haute élasticité.

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