C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 3/28 (2006.01) B29C 35/08 (2006.01) C08J 3/24 (2006.01) G01S 7/38 (2006.01) H01F 1/42 (2006.01)
Patent
CA 2352835
The present invention is a short time curing method of epoxy resin compositions composed of epoxy resins with more than 1.8 epoxy groups and curing agents which can react with epoxy groups and cure the epoxy resins at ambient temperatures or under the temperature raising conditions radiating microwave in the range of 300 MH Z to 30 GH Z frequency.
Matsuura Makoto
Nakanishi Hiroshi
Shimizu Takashi
Takao Yoshino
Takeshima Hideo
Nippon Liner Co. Ltd.
Smart & Biggar
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