A curing method to cure epoxy resins in a short time, and a...

C - Chemistry – Metallurgy – 08 – J

Patent

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Details

C08J 3/28 (2006.01) B29C 35/08 (2006.01) C08J 3/24 (2006.01) G01S 7/38 (2006.01) H01F 1/42 (2006.01)

Patent

CA 2352835

The present invention is a short time curing method of epoxy resin compositions composed of epoxy resins with more than 1.8 epoxy groups and curing agents which can react with epoxy groups and cure the epoxy resins at ambient temperatures or under the temperature raising conditions radiating microwave in the range of 300 MH Z to 30 GH Z frequency.

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