B - Operations – Transporting – 23 – B
Patent
B - Operations, Transporting
23
B
B23B 27/18 (2006.01) B23P 15/28 (2006.01) B32B 15/00 (2006.01) C22C 29/08 (2006.01) E21B 10/46 (2006.01) E21B 10/567 (2006.01)
Patent
CA 2685668
The present disclosure relates in one aspect to a cutting element comprising a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer comprises an ultra hard material. The substrate comprises tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80 % to less than 85 %. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80 % to less than 85 %. Also included are drill bits incorporating such cutting elements. Additionally, the present disclosure relates to methods of manufacturing cutting elements.
Belnap Daniel J.
Corbett Loel G.
Oyen Wiggs Green & Mutala Llp
Smith International Inc.
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