A device with bonded conductive and insulating substrates...

G - Physics – 01 – L

Patent

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G01L 9/12 (2006.01) G01L 9/00 (2006.01)

Patent

CA 2102506

2102506 9320423 PCTABS00027 A device with bonded and conductive substrates is disclosed. This device includes a conductive substrate (509) having an electrically insulating layer (515) disposed on a portion thereon. An electrically conductive layer (519) is disposed on the electrically insulating layer (515). Then an insulating substrate (101) having a first surface (103) and an opposing second surface (105) with an electrically conductive coating (516) disposed on a portion thereon is provided. Finally, the insulating substrate (101) is bonded to the electrically conductive layer (519).

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