C - Chemistry – Metallurgy – 10 – M
Patent
C - Chemistry, Metallurgy
10
M
C10M 169/00 (2006.01) C08K 3/36 (2006.01) C08L 53/02 (2006.01) G02B 6/44 (2006.01) H01B 3/22 (2006.01) H01B 7/28 (2006.01) H01B 7/282 (2006.01) H01B 7/285 (2006.01)
Patent
CA 2123200
2123200 9309208 PCTABS00022 The description relates to a filler for electrical and optical devices like cables, strips, plugs, etc., which is characterized by containing a material with a star-shaped molecular structure. Such includes especially an oligo-dec-1-en with a degree of oligomerisation of 3 and over. If to this is added finely divided silicic acid and a high-molecular polyolefine or a viscosity improver like hydrated polyisoprene, fillers are obtained having improved thermal properties like cone penetration at -50 ·C and leak resistance up to +80 ·C.
Andres Johannes
Heucher Reimar
Wichelhaus Juergen
Henkel Kommanditgesellschaft Auf Aktien
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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