A flexible, polyamide-containing multi-layer film having an...

Details A flexible, polyamide-containing multi-layer film having an... A flexible, polyamide-containing multi-layer film having an...

B - Operations, Transporting

32

B

B32B 27/08 (2006.01) B32B 27/32 (2006.01) B32B 27/34 (2006.01) B65D 65/40 (2006.01)

Patent

CA 2261516

The present invention relates to a multi-layer film for use as a thermoforming film, consisting of one or more polyamide-containing layers (I, I', I", etc.), a layer sequence (II) on the sealing outer face of the film, optionally one or more EVOH- containing layers (III, III', III", etc.) and optionally further layers also, wherein the multi-layer film has a water content of at least 0.5 and at most 2.5 % by weight, with respect to the total weight of the PA- and EVOH-containing layers, before processing to form a hollow.

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