A flux formulation

Details A flux formulation A flux formulation

B - Operations, Transporting

23

K

B23K 35/363 (2006.01) B23K 1/20 (2006.01) B23K 35/36 (2006.01) H05K 3/22 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2261258

A flux formulation without a surfactant for use in the assembly of electronic circuit boards as a no-clean formulation. The formulation comprises a flux solution having a fluxing agent consisting essentially of one or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOCs). The method comprises the step of heating the flux solution and dispersing it as a fine spray.

L'invention concerne une formulation de flux dénuée d'agent tensioactif, à utiliser dans l'assemblage de plaquettes de circuit imprimé électronique sous forme de formulation non décapante. Ladite formulation comporte une solution de flux comprenant un agent fluxant constitué essentiellement par un ou plusieurs acides organiques faibles et un solvant consistant essentiellement en eau. La solution de flux sert à transporter l'agent fluxant avant qu'il soit déposé sur un site de soudage, pour augmenter la fiabilité grâce à l'absence de reste hygroscopique et empêcher la dégradation de l'environnement grâce à l'absence de produits chimiques organiques volatils. Le procédé selon l'invention consiste à chauffer la solution de flux et à la disperser sous forme de fines gouttelettes.

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